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IEC 60227-7 AMD 2-2011 额定电压达到450/750V及以上的聚氯乙烯绝缘电缆.第7部分:带两根或两根以上导电芯的屏蔽性和非屏蔽性挠性电缆;修改件2

作者:标准资料网 时间:2024-05-22 07:46:01  浏览:9922   来源:标准资料网
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【英文标准名称】:Polyvinylchlorideinsulatedcablesofratedvoltagesuptoandincluding450/750V-Part7:Flexiblecablesscreenedandunscreenedwithtwoormoreconductors;Amendment2
【原文标准名称】:额定电压达到450/750V及以上的聚氯乙烯绝缘电缆.第7部分:带两根或两根以上导电芯的屏蔽性和非屏蔽性挠性电缆;修改件2
【标准号】:IEC60227-7AMD2-2011
【标准状态】:现行
【国别】:国际
【发布日期】:2011-09
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC20
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Cables;Electriccables;Electricalengineering;Flexible;Insulatedcables;Low-tensioncables;Low-voltageinstallations;PVCinsulations
【摘要】:
【中国标准分类号】:K13
【国际标准分类号】:29_035_20;29_060_20;33_120_20
【页数】:20P;A4
【正文语种】:英语


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【英文标准名称】:Specificationfortouchandclosefasteners
【原文标准名称】:接触和密闭式紧固件规范
【标准号】:BS7271-1990
【标准状态】:作废
【国别】:英国
【发布日期】:1990-02-28
【实施或试行日期】:1990-02-28
【发布单位】:英国标准学会(BSI)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:尺寸稳定性试验;性能试验;扣锁(服装);剥离试验;剪切试验;抽样方法;服饰;性能;试验设备;试样制备;作标记;宽度测量;试验条件;耐久试验
【英文主题词】:
【摘要】:
【中国标准分类号】:J13
【国际标准分类号】:61_040
【页数】:12P;A4
【正文语种】:英语


【英文标准名称】:Electronicdesignautomationlibraries-Part3:ModelsofintegratedcircuitsforEMIbehaviouralsimulation
【原文标准名称】:电子设计自动化程序库.第3部分:EMI行为模拟用集成电路的模型
【标准号】:IEC/TR62014-3-2002
【标准状态】:现行
【国别】:国际
【发布日期】:2002-12
【实施或试行日期】:
【发布单位】:国际电工委员会(IEC)
【起草单位】:IEC/TC93
【标准类型】:()
【标准水平】:()
【中文主题词】:输入;数字集成电路;电子设备及元件;电子设备及元件;规范(验收);集成电路;数字电路;定义;自动化
【英文主题词】:digitalintegratedcircuits;automation;emi;electronicequipmentandcomponents;input;integratedcircuits;definition;digitalcircuits;definitions;specification(approval)
【摘要】:TheobjectiveofthisTechnicalReport(TR)ICEM(IntegratedCircuitElectricalModel)forComponentsistoproposeelectricalmodellingforintegratedcircuitinternalactivities.Thismodelwillbeusedtoevaluateelectromagneticbehaviourandperformancesofelectronicequipment.1GeneralIntegratedcircuitsintegratemoreandmoregatesonsiliconandthetechnologiesarefasterandfaster.Topredicttheelectromagneticbehaviourofequipment,itisrequiredtomodelICinterfaceswitchingandtheirinternalactivitiesaswell.IndeedIBISandIMICmodelsarefocusedmainlyoninterfaceactivitypredictions(cross-talk,overshoot,etc.).SeeIEC62014-1.ThisreportdescribesamodelforEMIsimulationduetoICinternalactivities.Thismodelgivesmoreaccuratelytheelectromagneticemissionsofelectronicequipmentbytakingintoaccounttheinfluenceofinternalactivities.ThismodelgivesgeneraldatawhichcouldbeimplementedindifferentformatsuchasIBIS,IMIC,SPICE,etc.DuringthedesignstageoftheapplicationthatwillexploittheIC,itbecomesusefultopredictandtopreventelectromagneticriskswiththeCADtool.AccurateICmodellingisnecessarytorunonthesesimulationtools.Threecouplingmechanismsoftheinternalactivitiesforemission(Figure1)areproposedintheICEMmodel:·conductedemissionsthroughsupplylines;·conductedemissionsthroughinput/outputlines;·directradiatedemissions.Thisreportproposesamodelthataddressesthosethreetypesofcouplinginasingleapproach.Theelementsofthemodelwouldbekeptassimpleaspossibletoeasetheidentificationandsimulationprocess.2PhilosophyThepurposeofthisreportistoprovidedatatoenableprinted-circuit-boardlevel(PCB)electromagnetictoolstocomputetheelectromagneticfieldsproducedbyintegratedcircuitsandtheirassociatedPCB.Thesedatacanbeextractedfrommeasurementmethods,asdescribedinIEC61967,orobtainedfromICsimulationtools.2.1OriginofparasiticemissionTheoriginofparasiticemissioninICisduetothecurrentflowingthroughalltheICgates(IvandIv)duringhightoloworlowtohightransitionsasshowninFigure2.Thecombinationofseveralhundredthousandsofgatesleadtoveryimportantpeaksofcurrent,mainlyatriseandfalledgesoftheclockcircuit.ForexampleFigure3plotsthenumberofgatesswitchingversusthetimeforanICintegrating1000000transistors.Consequently,highcurrentspikesarecreatedinsidethedieandinducevoltagedropsoftheinternalvoltagereferences.2.2Conductedemissionthroughpower-supplylinesThecurrentspikescreatedinsidethediearepartiallyreducedthankstotheon-chipdecouplingcapacitance.Anyhow,asignificantportionofthecurrentspikesispresentatthepower-supplypinsofthechip.ThiscurrentcouldbemeasuredaccordingtoIEC61967orothermethodspermittingtohavethepower-supplycurrents.2.3Conductedemissionsthroughinput/outputlines(I/O)TheinternalvoltagedropsgeneratedbythecurrentspikescreatenoiseontheI/Osthroughdirectconnection,parasiticcapacitiveandinductivecouplingsand/orthroughcommonimpedance.ThePCBwiresconnectedtotheI/Ocanactasantennasandpropagateelectromagneticemissions.Themeasurementset-upisdoneaccordingtoIEC61967.2.4DirectradiatedemissionsTheinternalcurrentflowinginlowimpedanceloopsgenerateselectromagneticfieldswhichcanbemeasuredinnearfieldaccordingtoIEC61967.
【中国标准分类号】:L77
【国际标准分类号】:35_240_50;31_200;25_040_01
【页数】:20P.;A4
【正文语种】:英语



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